// SPEC · 耐火原料
绿色碳化硅 SiC 99% 高纯
绿色碳化硅SiC含量≥99%，Fe2O3≤0.05%，纯度高，杂质少。适用于半导体硅片研磨抛光、光学元件精密磨削、硬质合金刀具砂轮制造及光伏硅锭线锯切割工序。
// 主要特性
- SiC ≥99% purity eliminates metallic contamination in semiconductor-grade applications
- Superior crystal perfection yields sharper fracture edges than standard black SiC
- Ultra-low Fe2O3 ≤0.05% meets stringent cleanliness requirements for electronics processing
- Higher thermal stability supports precision machining of advanced ceramics and sapphire
// 技术规格
| SiC (%) | ≥99.0 |
| Fe2O3 (%) | ≤0.05 |
| Free C (%) | ≤0.10 |
| Hardness (Mohs) | 9.5 |
| Available Grain Sizes | F60–F1200, P80–P2500 |
// 应用领域
Semiconductor silicon wafer lapping and chemical-mechanical polishingOptical lens, prism, and sapphire substrate precision grindingCemented carbide and CBN tool blank grinding wheel productionPhotovoltaic silicon ingot wire-saw slicing operationsAdvanced SiC power device substrate and ceramic component machining
// 快速规格
最高温度1700°C
导热系数120 W/(m·K) at 25°C
体积密度3.21 g/cm³
执行标准GB/T 2481.1, FEPA F/P
// 获取报价