// SPEC · Foam Insulation
EPS Foam Board 15 kg/m³ — Low Density Packaging & Décor Grade
Low-density 15 kg/m³ EPS foam board for industrial packaging and decorative architectural mouldings. Ultra-lightweight with excellent cushioning properties. Suited for appliance packaging lines, EPS cornice profiles, and suspended ceiling tile blanks.
// Key Features
- Ultra-low 15 kg/m³ density delivering minimum freight cost and structural dead load
- Excellent impact cushioning performance for fragile industrial goods packaging
- Easy CNC and hot-wire machinability for complex decorative profile cutting
- Consistent fine cell structure ensuring uniform surface finish on moulded profiles
// Technical Specifications
| Fire Class | B2 (GB 8624) |
| Water Absorption (%) | ≤3.0 |
| Bulk Density (kg/m³) | 13–17 |
| Compressive Strength (kPa) | ≥50 |
| Thermal Conductivity (W/m·K) | ≤0.040 |
// Applications
Industrial appliance and consumer electronics protective packaging liner insertsDecorative EPS cornice, column cap, and ceiling rose moulding profilesSuspended ceiling tile and drop-ceiling panel substrate blanksRetail display fixture, point-of-sale prop, and exhibition stand fabricationLightweight architectural feature wall infill and relief panel elements
// Quick Specs
Max Temperature75°C
Thermal Conductivity0.040 W/(m·K) at 10°C
Density15 kg/m³
StandardGB/T 10801.1
// Get Pricing
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