// SPEC · Ceramic Fiber
Vacuum-Formed Ceramic Fiber Board 1260°C Low Binder
Vacuum-formed ceramic fiber board 1260°C with low binder enables complex near-net shapes and clean firing for semiconductor furnaces, dental kilns, and precision heat treatment equipment linings.
// Key Features
- Near-net-shape vacuum forming for complex precision components
- Low binder content for minimal outgassing and clean firing atmosphere
- Excellent surface finish for close-tolerance kiln furniture applications
- Custom profile capability for setters, saggers, and end closures
// Technical Specifications
| Al2O3 (%) | 47 |
| Bulk Density (kg/m³) | 300 |
| Classification Temp (°C) | 1260 |
| Linear Shrinkage at Rated Temp (%) | 2 |
| Thermal Conductivity at 600°C (W/m·K) | 0.16 |
// Applications
Semiconductor diffusion furnace tube end cap and baffleDental porcelain and zirconia firing furnace insulationPrecision investment casting burnout furnace liningFiber optic preform drawing furnace hot zoneLaboratory and research high-temperature furnace lining
// Quick Specs
Max Temperature1260°C
Thermal Conductivity0.16 W/(m·K) at 600°C
Density300 kg/m³
StandardGB/T 17393
// Get Pricing
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