// SPEC · Refractory Raw Materials
Black Silicon Carbide Fine Grit F100–F220
Black silicon carbide F100–F220 fine grit (SiC 98%) for precision lapping, optical glass polishing, and semiconductor back-grinding — delivers Ra ≤0.8 μm surface finish on ceramics and hard metals.
// Key Features
- Fine grit enables Ra ≤0.8 μm surface finish on ceramics and hardened metals
- Tight particle size distribution minimizes scratching in precision lapping operations
- Low free carbon content prevents contamination of optically sensitive substrates
- Consistent Mohs 9.5 hardness ensures repeatable stock removal in fine grinding cycles
// Technical Specifications
| SiC (%) | ≥98.0 |
| Fe2O3 (%) | ≤0.15 |
| Free C (%) | ≤0.25 |
| Hardness (Mohs) | 9.5 |
| Available Grain Sizes | F100, F120, F150, F180, F220 |
// Applications
Lapping machine tooling for cemented carbide and ceramic componentsOptical lens and crystal polishing equipmentSemiconductor silicon wafer back-grinding operationsFine grinding wheel and honing stone productionHard chrome and thermal spray coating surface finishing
// Quick Specs
Max Temperature1600°C
Thermal Conductivity120 W/(m·K) at 25°C
Density3.21 g/cm³
StandardGB/T 2481.1, FEPA F
// Get Pricing
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